Publication detail

Contact Resonance Imaging with Vertical Nanowire Arrays

FAHRBACH, M. JIUSHAI, X. KLAPETEK, P. MARTINEK, J. PEINER, E.

Original Title

Contact Resonance Imaging with Vertical Nanowire Arrays

Type

conference paper

Language

English

Original Abstract

A setup for high-throughput measurement of dimensional and mechanical parameters of silicon microwire and resist microwire arrays is used for combined topography and contact resonance imaging. It is based on customized long slander piezoresistive silicon microprobes designed for in-line measurements of industrial workpieces. In measurements with microwire and nanowire arrays we found sub-micrometer resolution on large areas (300umx300um) at high speed up to 300 um/s. Using a mass-spring model, characteristic features of contact resonance imaging with slender microprobes were simulated.

Keywords

modal analysis, finite element method, ultrasonic testing, fundamental frequency

Authors

FAHRBACH, M.; JIUSHAI, X.; KLAPETEK, P.; MARTINEK, J.; PEINER, E.

Released

11. 5. 2022

Publisher

AMA Service GmbH

Location

Nuremberg

ISBN

9783800758364

Book

Sensoren und Messsysteme - 21. ITG/GMA Fachtagung

Edition

1.

Pages from

245

Pages to

250

Pages count

6

BibTex

@inproceedings{BUT182522,
  author="Michael {Fahrbach} and xu {jiushai} and Petr {Klapetek} and Jan {Martinek} and Erwin {Peiner}",
  title="Contact Resonance Imaging with Vertical Nanowire Arrays",
  booktitle="Sensoren und Messsysteme - 21. ITG/GMA Fachtagung",
  year="2022",
  series="1.",
  pages="245--250",
  publisher="AMA Service GmbH",
  address="Nuremberg",
  isbn="9783800758364"
}