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Publication detail
MALVIYA, A. SENGAR, N. DUTTA, M.K. BURGET, R. MYSKA, V.
Original Title
Deep Learning Based Gastro Intestinal Disease Analysis Using Wireless Capsule Endoscopy Images
Type
conference paper
Language
English
Original Abstract
Accurate detection of gastrointestinal illnesses is decisive for early cancer diagnosis and its treatment. However, manual analysis is time-consuming and requires a professional gastroenterologist. An efficient, robust and light-weight multi-class classification framework is proposed for screening different gastrointestinal diseases. A shallow neural network is developed that can extract the discriminative features by convolution of wireless capsule endoscopy (WCE) image even though the diseased images share common patterns. The network is optimised with various optimisation techniques to get the most optimised classification network. The proposed framework is capableof handling the challenges present in the dataset to improve the efficacy of the classification network. The network diagnoses unseen WCE image with 90% accuracy. The developed architecture is compared with other state-of-the-art networks and found to be highly efficient. The proposed network has the potential to perform better in limited computation and resource requirements.
Keywords
Artificial intelligence; Capsule endoscopy; Deep learning; Lesion detection
Authors
MALVIYA, A.; SENGAR, N.; DUTTA, M.K.; BURGET, R.; MYSKA, V.
Released
15. 8. 2022
Publisher
Institute of Electrical and Electronics Engineers Inc.
ISBN
9781665469487
Book
TSP 2022: 2022 45th International Conference on Telecommunications and Signal Processing
Pages from
221
Pages to
225
Pages count
5
URL
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9851383
BibTex
@inproceedings{BUT183058, author="MALVIYA, A. and SENGAR, N. and DUTTA, M.K. and BURGET, R. and MYSKA, V.", title="Deep Learning Based Gastro Intestinal Disease Analysis Using Wireless Capsule Endoscopy Images", booktitle="TSP 2022: 2022 45th International Conference on Telecommunications and Signal Processing", year="2022", pages="221--225", publisher="Institute of Electrical and Electronics Engineers Inc.", doi="10.1109/TSP55681.2022.9851383", isbn="9781665469487", url="https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9851383" }