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Publication detail
Szendiuch,I., Vaško,C., Cejtchaml,P.
Original Title
Lead-free Solder Joint Quality Investigation
Type
conference paper
Language
English
Original Abstract
It is described lead-free solder joint behaviour
Keywords
Solder joint, quality, reliability
Authors
RIV year
2006
Released
10. 5. 2006
Publisher
Verlag dr. Markus A. Deter
Location
Germany
ISBN
3-934142-23-0
Book
Proceedings of 29th International Spring Seminar on Electronics Technology
Edition number
1
Pages from
84
Pages to
87
Pages count
4
BibTex
@inproceedings{BUT19127, author="Ivan {Szendiuch} and Pavel {Cejtchaml} and Cyril {Vaško}", title="Lead-free Solder Joint Quality Investigation", booktitle="Proceedings of 29th International Spring Seminar on Electronics Technology", year="2006", volume="2006", number="1", pages="4", publisher="Verlag dr. Markus A. Deter", address="Germany", isbn="3-934142-23-0" }