Publication detail

Thermal Stress in Multisubstrate Structure

Novotný, M.

Original Title

Thermal Stress in Multisubstrate Structure

Type

conference paper

Language

English

Original Abstract

Thrmomechanical stressing of microeletronics structure Al2O3, FR4.

Key words in English

Thermal stress, ANSYS, MSM

Authors

Novotný, M.

RIV year

2005

Released

1. 1. 2005

Publisher

Zdeněk Novotný

Location

Brno

ISBN

80-214-2889-9

Book

Proceedings of the 11th Conference Student EEICT 2005.

Edition number

první

Pages from

83

Pages to

86

Pages count

4

BibTex

@inproceedings{BUT21420,
  author="Marek {Novotný}",
  title="Thermal Stress in Multisubstrate Structure",
  booktitle="Proceedings of the 11th Conference Student EEICT 2005.",
  year="2005",
  number="první",
  pages="4",
  publisher="Zdeněk Novotný",
  address="Brno",
  isbn="80-214-2889-9"
}