Publication detail

Measuring Thermomechanical Reliability of Solder Joint in Electronic

ŠANDERA, J.

Original Title

Measuring Thermomechanical Reliability of Solder Joint in Electronic

Type

conference paper

Language

English

Original Abstract

Methodology of measure thermomechanical reliability of the solder joint is presented. original electrical method of measure mechanical crack in system follous.

Keywords

reliability, solder joint, electronic

Authors

ŠANDERA, J.

RIV year

2006

Released

14. 6. 2006

Publisher

Zdeněk Novotný, Brno, Ondráčkova 105

Location

Brno

ISBN

80-214-3246-2

Book

EDS06 Imaps CS International Conference Proceedings

Edition number

1. vydání

Pages from

281

Pages to

284

Pages count

4

BibTex

@inproceedings{BUT25137,
  author="Josef {Šandera}",
  title="Measuring Thermomechanical Reliability of Solder Joint in Electronic",
  booktitle="EDS06 Imaps CS International Conference Proceedings",
  year="2006",
  number="1. vydání",
  pages="4",
  publisher="Zdeněk Novotný, Brno, Ondráčkova 105",
  address="Brno",
  isbn="80-214-3246-2"
}