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Publication detail
NOVOTNÝ, M. SZENDIUCH, I.
Original Title
Methods of Chip Interconnection
Type
conference paper
Language
English
Original Abstract
This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).
Keywords
wire bonding, ANSYS, solder balls
Authors
NOVOTNÝ, M.; SZENDIUCH, I.
RIV year
2007
Released
1. 1. 2007
Publisher
Ing. Zdeněk Novotný CSc.
Location
Brno
ISBN
978-80-214-3470-7
Book
Electronics Devices and Systems 07 Proceedings
Edition number
první
Pages from
260
Pages to
264
Pages count
4
BibTex
@inproceedings{BUT25296, author="Marek {Novotný} and Ivan {Szendiuch}", title="Methods of Chip Interconnection", booktitle="Electronics Devices and Systems 07 Proceedings", year="2007", number="první", pages="260--264", publisher="Ing. Zdeněk Novotný CSc.", address="Brno", isbn="978-80-214-3470-7" }