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BĚHUNEK, I. FIALA, P.
Original Title
Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages
Type
conference paper
Language
English
Original Abstract
This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
Keywords
FEM, ANSYS, phase change, cooling, thermal management
Authors
BĚHUNEK, I.; FIALA, P.
RIV year
2007
Released
5. 10. 2007
Location
Lednice
ISBN
978-80-254-0301-3
Book
15. Ansys Users Meeting
Pages from
1
Pages to
12
Pages count
BibTex
@inproceedings{BUT25600, author="Ivo {Běhunek} and Pavel {Fiala}", title="Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages", booktitle="15. Ansys Users Meeting", year="2007", pages="1--12", address="Lednice", isbn="978-80-254-0301-3" }