Publication detail

Interconection In 3D Structure

KOSINA, P. HEJÁTKOVÁ, E. ŠANDERA, J.

Original Title

Interconection In 3D Structure

Type

conference paper

Language

English

Original Abstract

The paper is focuses on sintering LTCC Material for sintering and sintering without pre-processing.

Keywords

sintering, material, profile, wafer

Authors

KOSINA, P.; HEJÁTKOVÁ, E.; ŠANDERA, J.

RIV year

2008

Released

10. 9. 2008

Publisher

Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno

Location

Vysoké učení technické v brně, Antonínská 548/1, 602 00 Brno

ISBN

978-80-214-3717-3

Book

Electronic Devices and Systems IMAPS CS International Conference 2008 proceedings

Edition number

1

Pages from

261

Pages to

264

Pages count

4

BibTex

@inproceedings{BUT27500,
  author="Petr {Kosina} and Edita {Hejátková} and Josef {Šandera}",
  title="Interconection In 3D Structure",
  booktitle="Electronic Devices and Systems IMAPS CS International Conference 2008 proceedings",
  year="2008",
  number="1",
  pages="261--264",
  publisher="Ing. Zdeněk Novotný, CSc., Ondráčkova 105, 628 00 Brno",
  address="Vysoké učení technické v brně, Antonínská 548/1, 602 00 Brno",
  isbn="978-80-214-3717-3"
}