Publication detail

Roadmap of Lead-free Soldering

SZENDIUCH, I.

Original Title

Roadmap of Lead-free Soldering

Type

conference paper

Language

English

Original Abstract

lead-free soldering - overwiev of factors that has impact on lead free soldering process and life-time

Keywords

lead- free soldering, solders, fluxes, reliability, life-time

Authors

SZENDIUCH, I.

RIV year

2007

Released

7. 5. 2007

Publisher

TU Dresden

Location

Cluj-Napoca

ISBN

978-973-713-174-4

Book

Proceedings ISSE 2007

Edition

1

Edition number

1

Pages from

55

Pages to

60

Pages count

6

BibTex

@inproceedings{BUT28355,
  author="Ivan {Szendiuch}",
  title="Roadmap of Lead-free Soldering",
  booktitle="Proceedings ISSE 2007",
  year="2007",
  series="1",
  number="1",
  pages="55--60",
  publisher="TU Dresden",
  address="Cluj-Napoca",
  isbn="978-973-713-174-4"
}