Publication detail

Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition

NAVRÁTILOVÁ, L. PANTĚLEJEV, L. MAN, O. KUNZ, L.

Original Title

Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition

Type

conference paper

Language

English

Original Abstract

The objective of the present work was to study the stability of microstructure of ultra fine-grained (UFG) copper under high-cycle and very high-cycle fatigue loading and under thermal exposition. UFG Cu was prepared by equal channel angular pressing. No grain coarsening was observed after fatigue resulting in failure in the interval from 104 to 1010 cycles. Similarly, no grain coarsening was detected after thermal exposition at a temperature of 180 C for 6 min. The microstructure was examined by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM)

Keywords

UFG copper, ECAP, stability of microstructure, EBSD

Authors

NAVRÁTILOVÁ, L.; PANTĚLEJEV, L.; MAN, O.; KUNZ, L.

RIV year

2009

Released

22. 6. 2009

Publisher

University of Žilina

Location

Žilina, Sk

ISBN

978-80-554-0042-6

Book

Proceedings Transcom 2009

Edition

Section 5

Edition number

1

Pages from

149

Pages to

154

Pages count

6

BibTex

@inproceedings{BUT33240,
  author="Lucie {Navrátilová} and Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}",
  title="Stability of Microstructure of UFG Copper after Fatigue Loading and Thermal Exposition",
  booktitle="Proceedings Transcom 2009",
  year="2009",
  series="Section 5",
  number="1",
  pages="149--154",
  publisher="University of Žilina",
  address="Žilina, Sk",
  isbn="978-80-554-0042-6"
}