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PEKÁREK, J. VRBA, R. MAGÁT, M.
Original Title
Anodic bonding process in MEMS applications
Type
conference paper
Language
English
Original Abstract
Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.
Keywords
Anodic bonding, packaging, micro electro-mechanical systems (MEMS).
Authors
PEKÁREK, J.; VRBA, R.; MAGÁT, M.
RIV year
2010
Released
30. 8. 2010
Publisher
Brno University of Technology, Faculty of Electrical Engineering and Communication
Location
Tiskárna Atom, Ltd. Chuchelna 254, Semily
ISBN
978-80-214-4139-2
Book
Proceedings of 8th international conference KRÁLÍKY 2010
Edition number
1.
Pages from
103
Pages to
105
Pages count
3
BibTex
@inproceedings{BUT34624, author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát}", title="Anodic bonding process in MEMS applications", booktitle="Proceedings of 8th international conference KRÁLÍKY 2010", year="2010", number="1.", pages="103--105", publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication", address="Tiskárna Atom, Ltd. Chuchelna 254, Semily", isbn="978-80-214-4139-2" }