Publication detail
Chip Level Packaging - New Way to Higher Integration
SZENDIUCH, I.
Original Title
Chip Level Packaging - New Way to Higher Integration
Type
journal article - other
Language
English
Original Abstract
see paper
Key words in English
chip level packaging, integration
Authors
SZENDIUCH, I.
RIV year
2002
Released
23. 6. 2001
Pages from
9
Pages to
14
Pages count
6
BibTex
@{BUT70869
}