Publication detail

Modelling of 3D Multisubstrate Structures

BULVA, J.

Original Title

Modelling of 3D Multisubstrate Structures

Type

journal article - other

Language

English

Original Abstract

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Key words in English

ANSYS, MSM, modelling, thermomechanical properties

Authors

BULVA, J.

RIV year

2003

Released

24. 11. 2003

ISBN

1213-161X

Periodical

ElectronicsLetters.com - http://www.electronicsletters.com

Year of study

2003

Number

4/11

State

Czech Republic

Pages from

1

Pages to

1

Pages count

1

BibTex

@article{BUT41317,
  author="Jindřich {Bulva}",
  title="Modelling of 3D Multisubstrate Structures",
  journal="ElectronicsLetters.com - http://www.electronicsletters.com",
  year="2003",
  volume="2003",
  number="4/11",
  pages="1",
  issn="1213-161X"
}