Publication detail

Material Compatibility and Process Optimization in Lead Free Soldering

STARÝ, J.

Original Title

Material Compatibility and Process Optimization in Lead Free Soldering

Type

conference paper

Language

English

Original Abstract

Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.

Key words in English

lead-free, soldering, compatibility, wetting

Authors

STARÝ, J.

RIV year

2002

Released

30. 11. 2002

Location

Brno

ISBN

80-214-2217-3

Book

Socrates Workshop 2002- Proceedings.Intensive Training Programme in Electronic System Design.

Pages from

200

Pages to

204

Pages count

5

BibTex

@inproceedings{BUT4276,
  author="Jiří {Starý}",
  title="Material Compatibility and Process Optimization in Lead Free Soldering",
  booktitle="Socrates Workshop 2002- Proceedings.Intensive Training Programme in Electronic System Design.",
  year="2002",
  pages="5",
  address="Brno",
  isbn="80-214-2217-3"
}