Publication detail

Design and Reliability of the Connection in 3D Electronic Systems

ŠANDERA, J.

Original Title

Design and Reliability of the Connection in 3D Electronic Systems

Type

journal article - other

Language

English

Original Abstract

Theoretical study of properties for 3D electronic construction, world-known 3D electronoc connection, design 3D connection FR4-FR4, FR4-ceramic with respect to decrease thermomechanical stress, thermomechanical cyclic measuring and FEM simulation (software ANSYS).

Key words in English

3D assembly technology, microsystems, through hole technology, accelerated testing, solder joint reliability analysis with 3D FEA models, word’s constructions of 3D electronic systems, connection between organic materials (FR-4) and ceramic materials, FR4-FR4 structure, simulation of equivalent stress (SEQV), simulation of plastic work, Anand´s material model, the measuring of the reliability of solder connections, temperature cycling, eutectic Sn/Pb solder, lead free (LF) solder

Authors

ŠANDERA, J.

RIV year

2004

Released

1. 10. 2004

ISBN

1213-4198

Periodical

Vědecké spisy Vysokého učení technického v Brně Edice PhD Thesis

Number

275

State

Czech Republic

Pages from

1

Pages to

32

Pages count

32

URL

Vědecká knihovna VUT FEKT, UMEL

BibTex

@article{BUT45954,
  author="Josef {Šandera}",
  title="Design and Reliability of the Connection in 3D Electronic Systems",
  journal="Vědecké spisy Vysokého učení technického v Brně 
Edice PhD Thesis",
  year="2004",
  number="275",
  pages="32",
  issn="1213-4198",
  url="Vědecká knihovna VUT FEKT, UMEL"
}