Publication detail

RF-power-controlled Young's modulus of plasma-polymerized organosilicon films

ČECH, V. VANĚK, J. JONES, F. GORUPPA, A.

Original Title

RF-power-controlled Young's modulus of plasma-polymerized organosilicon films

Type

journal article - other

Language

English

Original Abstract

Elastic thin films of vinyltriethoxysilane were prepared by plasma-enhanced chemical vapor deposition using an RF (13.56 MHz) helical coupling plasma system. An effective power density ranging from 8 . 10-4 to 0.3 W cm-3 was used to control the Young's modulus of films to a range of 3.7 - 11.3 GPa. The modulus decreased slightly with the film thickness varying from 80 nm to 1.5 microns for films prepared under the same deposition conditions. The hardness of films (0.7 - 2.1 GPa) was proportional to the Young's modulus with a relatively high ratio of 0.185 associated with a higher mean compressive elastic strain with respect to other groups of plasma polymers (0.059 - 0.115). Thin films exhibited an abrupt increase in hardness at the film surface related to post-deposition oxidation.

Keywords

CVD; thin film; nanoindentation; mechanical properties; organosilicon

Authors

ČECH, V.; VANĚK, J.; JONES, F.; GORUPPA, A.

RIV year

2005

Released

1. 10. 2005

Publisher

Springer

ISBN

0022-2461

Periodical

Journal of Materials Science

Year of study

40

Number

18

State

United States of America

Pages from

5099

Pages to

5102

Pages count

4

BibTex

@article{BUT46352,
  author="Vladimír {Čech} and Jan {Vaněk} and Frank {Jones} and Alexander {Goruppa}",
  title="RF-power-controlled Young's modulus of plasma-polymerized organosilicon films",
  journal="Journal of Materials Science",
  year="2005",
  volume="40",
  number="18",
  pages="5099--5102",
  issn="0022-2461"
}