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ČECH, V. VANĚK, J. JONES, F. GORUPPA, A.
Original Title
RF-power-controlled Young's modulus of plasma-polymerized organosilicon films
Type
journal article - other
Language
English
Original Abstract
Elastic thin films of vinyltriethoxysilane were prepared by plasma-enhanced chemical vapor deposition using an RF (13.56 MHz) helical coupling plasma system. An effective power density ranging from 8 . 10-4 to 0.3 W cm-3 was used to control the Young's modulus of films to a range of 3.7 - 11.3 GPa. The modulus decreased slightly with the film thickness varying from 80 nm to 1.5 microns for films prepared under the same deposition conditions. The hardness of films (0.7 - 2.1 GPa) was proportional to the Young's modulus with a relatively high ratio of 0.185 associated with a higher mean compressive elastic strain with respect to other groups of plasma polymers (0.059 - 0.115). Thin films exhibited an abrupt increase in hardness at the film surface related to post-deposition oxidation.
Keywords
CVD; thin film; nanoindentation; mechanical properties; organosilicon
Authors
ČECH, V.; VANĚK, J.; JONES, F.; GORUPPA, A.
RIV year
2005
Released
1. 10. 2005
Publisher
Springer
ISBN
0022-2461
Periodical
Journal of Materials Science
Year of study
40
Number
18
State
United States of America
Pages from
5099
Pages to
5102
Pages count
4
BibTex
@article{BUT46352, author="Vladimír {Čech} and Jan {Vaněk} and Frank {Jones} and Alexander {Goruppa}", title="RF-power-controlled Young's modulus of plasma-polymerized organosilicon films", journal="Journal of Materials Science", year="2005", volume="40", number="18", pages="5099--5102", issn="0022-2461" }