Publication detail

Thermomechanical Modelling of Multisubstrate Modules

BÍLEK, J.

Original Title

Thermomechanical Modelling of Multisubstrate Modules

Type

conference paper

Language

English

Original Abstract

As today’s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from several ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates.

Keywords

ANSYS modelling, MSM, thermomechanical properties

Authors

BÍLEK, J.

RIV year

2002

Released

9. 9. 2002

Publisher

Ing.Zdeněk Novotný, CSc., Brno

Location

Brno

ISBN

80-214-2180-0

Book

Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission

Edition number

1

Pages from

230

Pages to

233

Pages count

4

BibTex

@inproceedings{BUT4776,
  author="Jaromír {Bílek}",
  title="Thermomechanical Modelling of Multisubstrate Modules",
  booktitle="Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission",
  year="2002",
  number="1",
  pages="4",
  publisher="Ing.Zdeněk Novotný, CSc., Brno",
  address="Brno",
  isbn="80-214-2180-0"
}