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Publication detail
SZENDIUCH, I.
Original Title
MSM System in Package - One Way to System Integration
Type
conference paper
Language
English
Original Abstract
The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.
Keywords
MSM, SOC, CSP, SIP
Authors
Released
1. 5. 2002
Publisher
TYPOS-Digital Print
Location
Praha
ISBN
0-7803-9824-6
Book
ISSE 2002
Edition number
1
Pages from
266
Pages to
268
Pages count
3
BibTex
@inproceedings{BUT4778, author="Ivan {Szendiuch}", title="MSM System in Package - One Way to System Integration", booktitle="ISSE 2002", year="2002", number="1", pages="3", publisher="TYPOS-Digital Print", address="Praha", isbn="0-7803-9824-6" }