Publication detail

MSM realized by Thick Film Technology

SZENDIUCH, I.

Original Title

MSM realized by Thick Film Technology

Type

conference paper

Language

English

Original Abstract

Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.

Keywords

Multi Substrate Modules (MSM), Stacking, Ball-termminal, Edge-terminal

Authors

SZENDIUCH, I.

RIV year

2002

Released

1. 1. 2002

Publisher

Vysoké učení technické v Brně

Location

Brno

ISBN

80-214-2180-0

Book

ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS

Pages from

211

Pages to

215

Pages count

5

BibTex

@inproceedings{BUT4949,
  author="Ivan {Szendiuch}",
  title="MSM realized by Thick Film Technology",
  booktitle="ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS",
  year="2002",
  pages="5",
  publisher="Vysoké učení technické v Brně",
  address="Brno
",
  isbn="80-214-2180-0"
}