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Publication detail
SZENDIUCH, I.
Original Title
MSM realized by Thick Film Technology
Type
conference paper
Language
English
Original Abstract
Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package solutions technologies. To describe and discuss some of the possible ways is the aim of this article.
Keywords
Multi Substrate Modules (MSM), Stacking, Ball-termminal, Edge-terminal
Authors
RIV year
2002
Released
1. 1. 2002
Publisher
Vysoké učení technické v Brně
Location
Brno
ISBN
80-214-2180-0
Book
ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS
Pages from
211
Pages to
215
Pages count
5
BibTex
@inproceedings{BUT4949, author="Ivan {Szendiuch}", title="MSM realized by Thick Film Technology", booktitle="ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS", year="2002", pages="5", publisher="Vysoké učení technické v Brně", address="Brno ", isbn="80-214-2180-0" }