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HÁZE, J. VRBA, R. PAVLÍK, M. PEKÁREK, J.
Original Title
A Novel Laboratory Anodic Bonding Device for MEMS Applications
Type
journal article - other
Language
English
Original Abstract
The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.
Keywords
anodic bonding, MEMS
Authors
HÁZE, J.; VRBA, R.; PAVLÍK, M.; PEKÁREK, J.
RIV year
2010
Released
7. 12. 2010
Publisher
ZCU Plzeň
Location
Plzeň
ISBN
1802-4564
Periodical
ElectroScope - http://www.electroscope.zcu.cz
Year of study
Number
3
State
Czech Republic
Pages from
24
Pages to
26
Pages count
BibTex
@article{BUT50401, author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}", title="A Novel Laboratory Anodic Bonding Device for MEMS Applications", journal="ElectroScope - http://www.electroscope.zcu.cz", year="2010", volume="2010", number="3", pages="24--26", issn="1802-4564" }