Publication detail

On the Application of Solder Balls for 3D Packaging

SZENDIUCH, I. NICÁK, M.

Original Title

On the Application of Solder Balls for 3D Packaging

Type

journal article - other

Language

English

Original Abstract

Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations

Keywords

solder ball, soldering, 3D configuration, 3D packaging

Authors

SZENDIUCH, I.; NICÁK, M.

RIV year

2010

Released

2. 8. 2010

Publisher

E.G.Leuze Verlag KG

Location

Německo

ISBN

1436-7505

Periodical

PLUS

Year of study

2010

Number

8

State

Federal Republic of Germany

Pages from

1855

Pages to

1860

Pages count

6

BibTex

@article{BUT50612,
  author="Ivan {Szendiuch} and Michal {Nicák}",
  title="On the Application of Solder Balls for 3D Packaging",
  journal="PLUS",
  year="2010",
  volume="2010",
  number="8",
  pages="1855--1860",
  issn="1436-7505"
}