Publication detail

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

TRIVEDI, R. ČECH, V.

Original Title

Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

Type

journal article - other

Language

English

Original Abstract

A plasma-polymerized tetravinylsilane film of about 1 micron thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Near-surface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

Keywords

plasma polymerization; thin films; nanoindentation

Authors

TRIVEDI, R.; ČECH, V.

RIV year

2010

Released

27. 12. 2010

ISBN

0257-8972

Periodical

Surface and Coatings Technology

Year of study

205

Number

Suppl 1

State

Swiss Confederation

Pages from

286

Pages to

289

Pages count

4

BibTex

@article{BUT50758,
  author="Rutul Rajendra {Trivedi} and Vladimír {Čech}",
  title="Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques",
  journal="Surface and Coatings Technology",
  year="2010",
  volume="205",
  number="Suppl 1",
  pages="286--289",
  issn="0257-8972"
}