Publication detail

Committing of electronic modules by ball pins and their reliability

ŠVECOVÁ, O. KOSINA, P. ŠANDERA, J. ADÁMEK, M.

Original Title

Committing of electronic modules by ball pins and their reliability

Type

abstract

Language

English

Original Abstract

The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). The measurements are still in progress, 1100 cycles have been performed up to now. In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20 to +100 degrees centigrade with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered onto boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials.

Keywords

Lead-free solder, solder joint, reliability, LTCC

Authors

ŠVECOVÁ, O.; KOSINA, P.; ŠANDERA, J.; ADÁMEK, M.

Released

12. 5. 2010

Publisher

Oficyna Wydawnicza Politechniki Warszawskiej

Location

Warsaw, Poland

ISBN

978-83-7207-870-4

Book

Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.

Edition number

1

Pages from

154

Pages to

155

Pages count

2

BibTex

@misc{BUT60933,
  author="Olga {Švecová} and Petr {Kosina} and Josef {Šandera} and Martin {Adámek}",
  title="Committing of electronic modules by ball pins and their reliability",
  booktitle="Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.",
  year="2010",
  edition="1",
  pages="154--155",
  publisher="Oficyna Wydawnicza Politechniki Warszawskiej",
  address="Warsaw, Poland",
  isbn="978-83-7207-870-4",
  note="abstract"
}