Publication detail

Anisotropic film construction using plasma nanotechnology (atomic polymerization)

HOFEREK, L. TRIVEDI, R. MISTRÍK, J. ČECH, V.

Original Title

Anisotropic film construction using plasma nanotechnology (atomic polymerization)

Type

abstract

Language

English

Original Abstract

Bilayers consisting of a-SiC:H and a-SiOC:H alloys were deposited on silicon wafer using plasma-enhanced chemical vapor deposition (PECVD). The layered structures were subjected to ellipsometric measurements that enabled us to distinguish individual layers and determine the layer thickness and its optical constants. In next study, single layer and multilayered a-SiC:H films, deposited from tetravinylsilane at different powers by PECVD, were investigated intensively by spectroscopic ellipsometry, nanoindentation, and atomic force microscopy (AFM) to compare optical and mechanical properties of the individual layer of decreased thickness (315 - 25 nm) with those of the corresponding single layer.

Keywords

plasma polymerization, thin films

Authors

HOFEREK, L.; TRIVEDI, R.; MISTRÍK, J.; ČECH, V.

Released

27. 12. 2010

Pages from

1

Pages to

2

Pages count

2

BibTex

@misc{BUT60975,
  author="Lukáš {Hoferek} and Rutul Rajendra {Trivedi} and Jan {Mistrík} and Vladimír {Čech}",
  title="Anisotropic film construction using plasma nanotechnology (atomic polymerization)",
  booktitle="IC-Plants 2010",
  year="2010",
  edition="1",
  pages="1--2",
  note="abstract"
}