Publication detail

Depth profile of mechanical properties for plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation

TRIVEDI, R. HOFEREK, L. ČECH, V.

Original Title

Depth profile of mechanical properties for plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation

Type

abstract

Language

English

Original Abstract

The near-surface mechanical properties of plasma polymer films are important parameters for their progressive applications such as protective coatings, scratch resistance and wear resistance layers, and functional interlayers. Selected mechanical properties, the Young's modulus and hardness, can be evaluated from conventional depth-sensing nanoindentation test, where the measuring cycle (load/unload-displacement curves) consists of a loading segment followed by a dwell time at maximum load, and followed by an unloading segment. In general, the loading causes both elastic and plastic deformation under the indenter, while unloading is dominated by recovery of the elastic deformation. The upper portion of the unloading curve can be used to calculate the mechanical properties at a given contact depth of the indenter according to the Oliver-Pharr method.

Keywords

Thin film, plasma polymerization, nanoindentation, Young's modulus, hardness

Authors

TRIVEDI, R.; HOFEREK, L.; ČECH, V.

Released

27. 12. 2010

Pages from

1

Pages to

1

Pages count

1

BibTex

@misc{BUT60977,
  author="Rutul Rajendra {Trivedi} and Lukáš {Hoferek} and Vladimír {Čech}",
  title="Depth profile of mechanical properties for plasma-polymerized tetravinylsilane films evaluated by cyclic nanoindentation",
  booktitle="PSE 2010",
  year="2010",
  edition="1",
  pages="1--1",
  note="abstract"
}