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PULEC, J. SZENDIUCH, I.
Original Title
Contribution to modeling of stressing in microelectronic structures
Type
abstract
Language
English
Original Abstract
Topic of my article is modeling of thermomechanical stressing in modern microelectronic structures. Simulations are made using software ANSYS, which is based on Finite Element Method (FEM). Using this method, thermomechanical stressing in various structures was modeled. After simulations, data evaluation and comparison of yielded results was made to determine amplitudes and differences between stressing in various regions of modeled structure and between individual structures.
Keywords
ANSYS, Stressing, 3D Structures
Authors
PULEC, J.; SZENDIUCH, I.
Released
12. 5. 2010
Publisher
Oficyna Wydawnicza Politechniki Warszawskiej
Location
Warsaw, Poland
ISBN
978-83-7207-870-4
Book
Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.
Edition number
1
Pages from
218
Pages to
219
Pages count
2
BibTex
@misc{BUT61078, author="Jiří {Pulec} and Ivan {Szendiuch}", title="Contribution to modeling of stressing in microelectronic structures", booktitle="Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration.", year="2010", edition="1", pages="218--219", publisher="Oficyna Wydawnicza Politechniki Warszawskiej", address="Warsaw, Poland", isbn="978-83-7207-870-4", note="abstract" }