Publication detail

Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

STARÝ, J.

Original Title

Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Type

standard

Language

Czech

Authors

STARÝ, J.

Released

5. 3. 2006

Pages from

1

Pages to

3

Pages count

3

BibTex

@misc{BUT68190,
  author="Jiří {Starý}",
  title="Odborný posudek:IEC 61190-1-3 Ed. 2: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications",
  year="2006",
  pages="3",
  note="standard"
}