Přístupnostní navigace
E-application
Search Search Close
Publication detail
PANTĚLEJEV, L. MAN, O. KUNZ, L.
Original Title
Microstructural stability of ultrafine grained copper at elevated temperature
English Title
Type
journal article - other
Language
Czech
Original Abstract
Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
English abstract
Keywords
ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)
Key words in English
Authors
PANTĚLEJEV, L.; MAN, O.; KUNZ, L.
RIV year
2011
Released
13. 9. 2011
Publisher
Technická universita Košice
Location
Košice
ISBN
1335-1532
Periodical
Acta Metallurgica Slovaca
Year of study
17
Number
3
State
Slovak Republic
Pages from
158
Pages to
162
Pages count
5
BibTex
@article{BUT74820, author="Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz}", title="Microstructural stability of ultrafine grained copper at elevated temperature", journal="Acta Metallurgica Slovaca", year="2011", volume="17", number="3", pages="158--162", issn="1335-1532" }