Publication detail

Roadmap of Thermal Management Structure

BULVA, J.

Original Title

Roadmap of Thermal Management Structure

Type

conference paper

Language

English

Original Abstract

This paper focuses on the thermal management application for modern microelectronics systems. The aim is to describe basic physical principles of the heat transfer and thermal resistance. Simplified equations for the heat transfer within electronic components are introduced and a variety of cooling methods is also discussed.

Key words in English

thermal management, conduction, convection, radiation

Authors

BULVA, J.

RIV year

2003

Released

24. 4. 2003

Publisher

Ing. Zdeněk Novotný CSc, Ondráčkova 70a, Brno

Location

Brno

ISBN

80-214-2379-X

Book

Proceedings of 9th Conference and Competition STUDENT EEICT 2003 Volume 3

Edition number

1

Pages from

412

Pages to

416

Pages count

5

BibTex

@inproceedings{BUT7629,
  author="Jindřich {Bulva}",
  title="Roadmap of Thermal Management Structure",
  booktitle="Proceedings of 9th Conference and Competition STUDENT EEICT 2003 Volume 3",
  year="2003",
  number="1",
  pages="5",
  publisher="Ing. Zdeněk Novotný CSc, Ondráčkova 70a, Brno",
  address="Brno",
  isbn="80-214-2379-X"
}