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BULVA, J., SZENDIUCH, I.
Original Title
Influence of Bump Height to Multisubstrate Structures Construction
Type
conference paper
Language
English
Original Abstract
This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.
Key words in English
ANSYS, MSM, modelling, thermomechanical properties
Authors
RIV year
2003
Released
1. 1. 2003
Publisher
Ing. Zdeněk Novotný CSc., Brno
Location
Brno
ISBN
80-214-2452-4
Book
Proceedings of 10-th Electronic Devices and Systems Conference 2003
Edition
Neuveden
Edition number
Pages from
377
Pages to
381
Pages count
5
BibTex
@inproceedings{BUT8128, author="Jindřich {Bulva} and Ivan {Szendiuch}", title="Influence of Bump Height to Multisubstrate Structures Construction", booktitle="Proceedings of 10-th Electronic Devices and Systems Conference 2003", year="2003", series="Neuveden", volume="Neuveden", number="Neuveden", pages="5", publisher="Ing. Zdeněk Novotný CSc., Brno", address="Brno", isbn="80-214-2452-4" }