Publication detail

Packaging Trends and Development

SZENDIUCH, I.

Original Title

Packaging Trends and Development

Type

conference paper

Language

English

Original Abstract

Modern Packaging trends are described in this paper

Keywords

Packaging, Flip Chip, Wafer Level Packaging

Authors

SZENDIUCH, I.

RIV year

2003

Released

9. 9. 2003

Location

Brno

ISBN

80-214-2452-4

Book

EDS´03

Edition number

10th

Pages from

382

Pages to

387

Pages count

6

BibTex

@inproceedings{BUT8714,
  author="Ivan {Szendiuch}",
  title="Packaging Trends and Development",
  booktitle="EDS´03",
  year="2003",
  volume="2003",
  number="10th",
  pages="6",
  address="Brno",
  isbn="80-214-2452-4"
}