Publication detail

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

ŠANDERA, J.

Original Title

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

Type

conference paper

Language

English

Original Abstract

This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS

Key words in English

Interconnection failure, FEM, Thermomechanical stress, Darveaux s methodology, the viscoplastic strain energy density, stacked structure FR4-ceramic,power cycling procedure

Authors

ŠANDERA, J.

RIV year

2003

Released

20. 9. 2003

Publisher

Brno University of Technology

Location

Brno University of Technology

ISBN

80-214-2452-4

Book

Electronic Devices and Systems 2003 - Proceedins

Edition

Brno University of Technology

Pages from

394

Pages to

397

Pages count

4

BibTex

@inproceedings{BUT9412,
  author="Josef {Šandera}",
  title="Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate",
  booktitle="Electronic Devices and Systems 2003 - Proceedins",
  year="2003",
  series="Brno University of Technology",
  pages="4",
  publisher="Brno University of Technology",
  address="Brno University of Technology",
  isbn="80-214-2452-4"
}