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Publication detail
ŠANDERA, J., HEJÁTKOVÁ, E.
Original Title
Mechanical Stress of Chip SMD Components with Ceramic Body
Type
conference paper
Language
English
Original Abstract
The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.
Key words in English
chip ceramic capacitor, package 1206, CTE, ANSYS software
Authors
RIV year
2003
Released
20. 9. 2003
Location
Brno, University of Technology
ISBN
80-214-2452-4
Book
Electronic Devices and Systems
Pages from
398
Pages to
402
Pages count
5
BibTex
@inproceedings{BUT9561, author="Josef {Šandera} and Edita {Hejátková}", title="Mechanical Stress of Chip SMD Components with Ceramic Body", booktitle="Electronic Devices and Systems", year="2003", pages="5", address="Brno, University of Technology", isbn="80-214-2452-4" }