Publication detail

Thick Film 3-D Electrode Configuration for Electrochemical Applications

ADÁMEK, M. ŠTEKOVIČ, M. SZENDIUCH, I.

Original Title

Thick Film 3-D Electrode Configuration for Electrochemical Applications

Type

conference paper

Language

English

Original Abstract

Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper.

Keywords

Thick-Film sensor, 3-D structure, ball and wire bonding

Authors

ADÁMEK, M.; ŠTEKOVIČ, M.; SZENDIUCH, I.

RIV year

2012

Released

17. 9. 2012

Publisher

Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium

Location

Amsterdam

ISBN

978-1-4673-4644-3

Book

4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012

Edition

1

Edition number

1

Pages from

1

Pages to

6

Pages count

6

URL

http://www.estc2012.eu

BibTex

@inproceedings{BUT95826,
  author="Martin {Adámek} and Michal {Štekovič} and Ivan {Szendiuch}",
  title="Thick Film 3-D Electrode Configuration for Electrochemical Applications",
  booktitle="4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012",
  year="2012",
  series="1",
  number="1",
  pages="1--6",
  publisher="Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium",
  address="Amsterdam",
  isbn="978-1-4673-4644-3",
  url="http://www.estc2012.eu"
}