Publication detail

Effect of nitrogen atmosphere on the quality of lead-free solder joints

SCHNEDERLE, P. ADÁMEK, M. SZENDIUCH, I.

Original Title

Effect of nitrogen atmosphere on the quality of lead-free solder joints

Type

conference paper

Language

English

Original Abstract

Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper.

Keywords

Nitrogen, atmosphere, alumina, lead-free solder

Authors

SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I.

RIV year

2012

Released

28. 6. 2012

Publisher

Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno

Location

Brno

ISBN

978-80-214-4539-0

Book

EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS

Edition

1

Edition number

1

Pages from

308

Pages to

313

Pages count

6

BibTex

@inproceedings{BUT95900,
  author="Petr {Schnederle} and Martin {Adámek} and Ivan {Szendiuch}",
  title="Effect of nitrogen atmosphere on the quality of lead-free solder joints",
  booktitle="EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS",
  year="2012",
  series="1",
  number="1",
  pages="308--313",
  publisher="Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno",
  address="Brno",
  isbn="978-80-214-4539-0"
}