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PSOTA, B. SZENDIUCH, I.
Original Title
The Increasing Importance of the Thermal Management for Modern Electronic Packages
Type
journal article - other
Language
English
Original Abstract
This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.
Keywords
Thermal management, Electronic package, Simulation, ANSYS
Authors
PSOTA, B.; SZENDIUCH, I.
RIV year
2012
Released
31. 12. 2012
Publisher
Fakulta Elektrotechnická ZČU v Plzni
Location
Plzeň
ISBN
1802-4564
Periodical
ElectroScope - http://www.electroscope.zcu.cz
Year of study
Number
VI.
State
Czech Republic
Pages from
1
Pages to
5
Pages count
BibTex
@article{BUT96451, author="Boleslav {Psota} and Ivan {Szendiuch}", title="The Increasing Importance of the Thermal Management for Modern Electronic Packages", journal="ElectroScope - http://www.electroscope.zcu.cz", year="2012", volume="2012", number="VI.", pages="1--5", issn="1802-4564" }