Publication detail

The Increasing Importance of the Thermal Management for Modern Electronic Packages

PSOTA, B. SZENDIUCH, I.

Original Title

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Type

journal article - other

Language

English

Original Abstract

This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.

Keywords

Thermal management, Electronic package, Simulation, ANSYS

Authors

PSOTA, B.; SZENDIUCH, I.

RIV year

2012

Released

31. 12. 2012

Publisher

Fakulta Elektrotechnická ZČU v Plzni

Location

Plzeň

ISBN

1802-4564

Periodical

ElectroScope - http://www.electroscope.zcu.cz

Year of study

2012

Number

VI.

State

Czech Republic

Pages from

1

Pages to

5

Pages count

5

BibTex

@article{BUT96451,
  author="Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Increasing Importance of the Thermal Management for Modern Electronic Packages",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2012",
  volume="2012",
  number="VI.",
  pages="1--5",
  issn="1802-4564"
}