Publication detail

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

NICÁK, M. ŠANDERA, J. STARÝ, J. KOSINA, P. PSOTA, B.

Original Title

PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS

Type

journal article - other

Language

English

Original Abstract

This paper describes design, construction and some recent tests of 3D stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC).

Keywords

Packaging, 3D, LTCC, soldering

Authors

NICÁK, M.; ŠANDERA, J.; STARÝ, J.; KOSINA, P.; PSOTA, B.

RIV year

2012

Released

31. 12. 2012

Publisher

Fakulta Elektrotechnická ZČU v Plzni

Location

Plzeň

ISBN

1802-4564

Periodical

ElectroScope - http://www.electroscope.zcu.cz

Year of study

2012

Number

VI.

State

Czech Republic

Pages from

1

Pages to

5

Pages count

5

URL

http://ek702p10-ket.fel.zcu.cz/index.php?option=com_content&view=article&id=357:properties-of-3d-ltcc-structure-interconnections&catid=42:cislo-62012-eds-2012&Itemid=49

BibTex

@article{BUT96473,
  author="Michal {Nicák} and Josef {Šandera} and Jiří {Starý} and Petr {Kosina} and Boleslav {Psota}",
  title="PROPERTIES OF 3D LTCC STRUCTURE INTERCONNECTIONS",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2012",
  volume="2012",
  number="VI.",
  pages="1--5",
  issn="1802-4564",
  url="http://ek702p10-ket.fel.zcu.cz/index.php?option=com_content&view=article&id=357:properties-of-3d-ltcc-structure-interconnections&catid=42:cislo-62012-eds-2012&Itemid=49"
}