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MALČÍK, D. DRAHANSKÝ, M.
Original Title
Microscopic Analysis of The Chips: Chips deprocessing
Type
journal article - other
Language
English
Original Abstract
Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure. This paper is a sequel to our previous publication regarding chip decapsulation. A further process of chip deprocessing is presented, so that the reader should be able to decapsulate a chip and also reveal the secrets of bare transistors hidden under different layers. The obtained specimens can be analysed with use of a microscope. Main analysis of such specimens will be the target for our next work.
Keywords
microscope, chip, chip package, leadframe, decapsulation, bare chip, chip deprocessing, analysis of chips
Authors
MALČÍK, D.; DRAHANSKÝ, M.
RIV year
2012
Released
29. 6. 2012
Publisher
Springer Verlag
Location
Bali - Indonéská republika
ISBN
2287-1233
Periodical
Advanced Science and Technology Letters, Volume 4
Year of study
Number
7
State
Republic of the Philippines
Pages from
80
Pages to
85
Pages count
6
BibTex
@article{BUT96984, author="Dominik {Malčík} and Martin {Drahanský}", title="Microscopic Analysis of The Chips: Chips deprocessing", journal="Advanced Science and Technology Letters, Volume 4", year="2012", volume="2012", number="7", pages="80--85", issn="2287-1233" }