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PÁLESCH, E. KONTÁROVÁ, S. ČECH, V.
Original Title
Mechanical properties of plasma polymer films controlled by RF power
Type
conference paper
Language
English
Original Abstract
This study deals with plasma polymer films deposited on silicon substrates using tetravinylsilane monomer. The deposition technique was plasma-enhanced chemical vapour deposition. Nanoindentation was used as a method to investigate mechanical properties of samples prepared at different RF powers. The Youngs modulus and hardness of thin films were estimated from load-displacement curves. The nanoscratch test was employed to determine the critical normal load needed for film delamination, as a parameter describing adhesion to the substrate. AFM images of scratches were carried out to correlate the data with nature and shape of scratches.
Keywords
Thin films, plasma polymer, mechanical properties, nanoindentation, nanoscratch test
Authors
PÁLESCH, E.; KONTÁROVÁ, S.; ČECH, V.
Released
17. 12. 2012
Pages from
1
Pages to
4
Pages count
BibTex
@inproceedings{BUT97296, author="Erik {Pálesch} and Soňa {Kontárová} and Vladimír {Čech}", title="Mechanical properties of plasma polymer films controlled by RF power", booktitle="Proc. 13th Int. Conf. Plasma Surface Engineering", year="2012", pages="1--4" }