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POSPÍŠIL, T. PĚNČÍK, J.
Original Title
Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance
Type
conference paper
Language
English
Original Abstract
Today the quality of design of building envelope is greatly emphasized. We are trying to design houses without problematic structural details, which would create so called thermal bridges - areas with higher heat flow then the rest of the structure. One group of these problematic details is situated in the connection between base of the wall and foundations under it. Here the thermal insulation layer of the floor is disrupted by the masonry of the walls and partitions. This thermal bridge can be quiet large – it depends on the ground plan of the building. Today exists a lot of ways to solve this structural detail. One of them is insertion of thermal insulation material (e.g. foam glass) between on top of the foundation, under the first row of masonry. This paper compares three variants of solutions for this problematic detail, using different thicknesses of foam glass. Two-dimensional temperature field models were created for the assessed variants. These models were compared by linear thermal transmittance.
Keywords
steady state, foot of masonry, thermal bridges, linear thermal transmittance
Authors
POSPÍŠIL, T.; PĚNČÍK, J.
RIV year
2013
Released
12. 4. 2013
ISBN
978-80-553-1305-4
Book
Young scientist 2013
Pages from
1
Pages to
7
Pages count
BibTex
@inproceedings{BUT99525, author="Tomáš {Pospíšil} and Jan {Pěnčík}", title="Influence of thermal insulation material thickness used in wall footing to linear thermal transmittance", booktitle="Young scientist 2013", year="2013", pages="1--7", isbn="978-80-553-1305-4" }