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NOVOTNÝ, R. VLACH, R. KADLEC, J. KUCHTA, R.
Original Title
Optimization of ceramics bonding in the area of pressure sensor manufacturing
Type
journal article in Web of Science
Language
English
Original Abstract
Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved.
Keywords
ceramic, bonding, pressure, sensor, joint, technology
Authors
NOVOTNÝ, R.; VLACH, R.; KADLEC, J.; KUCHTA, R.
RIV year
2013
Released
1. 4. 2014
ISBN
0946-7076
Periodical
Microsystem Technologies
Year of study
20
Number
4-5
State
Federal Republic of Germany
Pages from
719
Pages to
728
Pages count
10
BibTex
@article{BUT103717, author="Radovan {Novotný} and Radek {Vlach} and Jaroslav {Kadlec} and Radek {Kuchta}", title="Optimization of ceramics bonding in the area of pressure sensor manufacturing", journal="Microsystem Technologies", year="2014", volume="20", number="4-5", pages="719--728", doi="10.1007/s00542-013-2013-7", issn="0946-7076" }