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PSOTA, B. BURŠÍK, M. SZENDIUCH, I.
Original Title
The Use of Computer Simulation in the Electronic Packaging Process
Type
abstract
Language
English
Original Abstract
This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.
Keywords
Simulation, Wirebonding, Ansys
Authors
PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.
Released
1. 7. 2013
Location
Brno, Česká republika
ISBN
978-80-214-4739-4
Book
Materials Structure & Micromechanics of Fracture
Pages from
182
Pages to
Pages count
1
BibTex
@misc{BUT104293, author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}", title="The Use of Computer Simulation in the Electronic Packaging Process", booktitle="Materials Structure & Micromechanics of Fracture", year="2013", pages="182--182", address="Brno, Česká republika", isbn="978-80-214-4739-4", note="abstract" }