Publication detail

Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging

KLÍMA, M. SOMER, J. BLAHOVÁ, L. PROCHÁZKA, M. SZENDIUCH, I.

Original Title

Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging

Type

conference proceedings

Language

English

Original Abstract

This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured – Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.

Keywords

LTCC, hermetic packaging, OTR

Authors

KLÍMA, M.; SOMER, J.; BLAHOVÁ, L.; PROCHÁZKA, M.; SZENDIUCH, I.

Released

20. 8. 2014

ISBN

978-3-934142-49-7

Book

Advances in Electronic System Integration - Book of Abtracts 37th International Spring Seminar on Electronics Technology

Pages from

99

Pages to

103

Pages count

5

BibTex

@proceedings{BUT108117,
  editor="Martin {Klíma} and Jakub {Somer} and Lucie {Janů} and Michal {Procházka} and Ivan {Szendiuch}",
  title="Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging",
  year="2014",
  pages="99--103",
  doi="10.1109/ISSE.2014.6887571",
  isbn="978-3-934142-49-7"
}