Publication detail

2D Modelling of Stresses in Solder Joint Connection

BULVA, J., SZENDIUCH, I.

Original Title

2D Modelling of Stresses in Solder Joint Connection

Type

conference paper

Language

English

Original Abstract

This paper describes thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Key words in English

ANSYS, modelling, solder joint quality

Authors

BULVA, J., SZENDIUCH, I.

RIV year

2004

Released

1. 1. 2004

Publisher

Ing. Zdeněk Novotný CSc.,Brno

Location

Brno

ISBN

80-214-2701-9

Book

11th Electronic Devices and Systems Conference 2004 Proceedings

Pages from

377

Pages to

756

Pages count

380

BibTex

@inproceedings{BUT11421,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="2D Modelling of Stresses in Solder Joint Connection",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  year="2004",
  pages="380",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  address="Brno",
  isbn="80-214-2701-9"
}