Publication detail

Wettability SnPb and Lead-free

SZENDIUCH, I., BULVA, J.

Original Title

Wettability SnPb and Lead-free

Type

conference paper

Language

English

Original Abstract

Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.

Keywords

lead free soldering, wettability

Authors

SZENDIUCH, I., BULVA, J.

RIV year

2004

Released

1. 1. 2004

Publisher

Ing. Zdeněk Novotný CSc.,Brno

Location

Brno

ISBN

80-214-2701-9

Book

11th Electronic Devices and Systems Conference 2004 Proceedings

Pages from

407

Pages to

411

Pages count

5

BibTex

@inproceedings{BUT11423,
  author="Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Wettability SnPb and Lead-free",
  booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings",
  year="2004",
  pages="407--411",
  publisher="Ing. Zdeněk Novotný CSc.,Brno",
  address="Brno",
  isbn="80-214-2701-9"
}