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SZENDIUCH, I., BULVA, J.
Original Title
Wettability SnPb and Lead-free
Type
conference paper
Language
English
Original Abstract
Lead free soldering implementation process needs some knowledge about behavior of lead-free materials where fundamental seems to be wettability. Without good wettability the process performance cannot be convenient technical and economical too. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, which are important for solder joint formation, and for final solder joint reliability. This includes optimal selection of fluxes, air/nitrogen atmosphere, solders alloy compositions, surface treatments of components and PCBs and other factors. This paper presents some facts from this area.
Keywords
lead free soldering, wettability
Authors
RIV year
2004
Released
1. 1. 2004
Publisher
Ing. Zdeněk Novotný CSc.,Brno
Location
Brno
ISBN
80-214-2701-9
Book
11th Electronic Devices and Systems Conference 2004 Proceedings
Pages from
407
Pages to
411
Pages count
5
BibTex
@inproceedings{BUT11423, author="Ivan {Szendiuch} and Jindřich {Bulva}", title="Wettability SnPb and Lead-free", booktitle="11th Electronic Devices and Systems Conference 2004 Proceedings", year="2004", pages="407--411", publisher="Ing. Zdeněk Novotný CSc.,Brno", address="Brno", isbn="80-214-2701-9" }