Publication detail

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

SKÁCEL, J. SZENDIUCH, I.

Original Title

THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES

English Title

ThermoMechanical SIMULATION OF MODERN ELECTRONIC PACKAGES

Type

conference paper

Language

Czech

Original Abstract

This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.

English abstract

This paper deals with issue of modern electronic packages Mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad Flat No-leads) and BGA (Ball Grid Array) packages Including Their Advantages and disadvantages. The second part is focused on These packages of simulation in ANSYS program from the point of thermos-mechanical behavior.

Keywords

ANSYS, BGA, QFN, thermo-mechanical behavior

Key words in English

ANSYS, BGA, QFN, thermo-mechanical behavior

Authors

SKÁCEL, J.; SZENDIUCH, I.

RIV year

2015

Released

23. 4. 2015

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Location

Brno

ISBN

978-80-214-5148-3

Book

Proceedings of the 21st Conference STUDENT EEICT 2015

Pages from

289

Pages to

291

Pages count

3

URL

http://www.feec.vutbr.cz/EEICT/2015/sbornik/EEICT-2015-sbornik-komplet_v2.pdf

BibTex

@inproceedings{BUT117506,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="THERMOMECHANICAL SIMULATION OF MODERN
ELECTRONIC PACKAGES",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  year="2015",
  pages="289--291",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5148-3",
  url="http://www.feec.vutbr.cz/EEICT/2015/sbornik/EEICT-2015-sbornik-komplet_v2.pdf"
}