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PSOTA, B. SZENDIUCH, I. OTÁHAL, A.
Original Title
Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis
Type
conference paper
Language
English
Original Abstract
This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used.
Keywords
Simulation; PCB; design; ANSYS
Authors
PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A.
RIV year
2015
Released
14. 9. 2015
ISBN
978-0-9568086-1-5
Book
Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition
Pages from
1
Pages to
4
Pages count
URL
https://ieeexplore.ieee.org/document/7390679
BibTex
@inproceedings{BUT118145, author="Boleslav {Psota} and Ivan {Szendiuch} and Alexandr {Otáhal}", title="Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis", booktitle="Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition", year="2015", pages="1--4", isbn="978-0-9568086-1-5", url="https://ieeexplore.ieee.org/document/7390679" }