Publication detail

COMPARISON OF QFN AND BGA CHARACTERISTICS

SKÁCEL, J. PSOTA, B. SZENDIUCH, I.

Original Title

COMPARISON OF QFN AND BGA CHARACTERISTICS

Type

conference paper

Language

English

Original Abstract

This paper deals with the issue of packaging and heat transfer in modern microelectronics. Research is focused on the QFN and BGA packages, the most sophisticated conventional solution nowadays. Thermal characteristics are examined through the computer simulations in the program ANSYS Workbench as well as through the experimental measuring. Real measurement is necessary for the verification of the calculated results; afterwards we are able to modify the model to observe the influence of the changes to the package characteristics. Last part is focused on the problem of voids after soldering process in QFN package and comparison of soldering in air and in the desiccator with nitrogen atmosphere with 200ppm residual oxygen. The results are presented through the X-ray inspection of thermal pad.

Keywords

QFN, BGA, ANSYS, thermo-mechanical behavior

Authors

SKÁCEL, J.; PSOTA, B.; SZENDIUCH, I.

RIV year

2015

Released

15. 10. 2015

Publisher

Vysoké účení technické v Brně

Location

BRNO

ISBN

978-80-214-5270-1

Book

IMAPS FLASH CONFERENCE 2015

Edition

1

Edition number

1

Pages from

25

Pages to

26

Pages count

65

BibTex

@inproceedings{BUT120068,
  author="Josef {Skácel} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="COMPARISON OF QFN AND BGA CHARACTERISTICS",
  booktitle="IMAPS FLASH CONFERENCE 2015",
  year="2015",
  series="1",
  number="1",
  pages="25--26",
  publisher="Vysoké účení technické v Brně",
  address="BRNO",
  isbn="978-80-214-5270-1"
}