Publication detail

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

OTÁHAL, A. CRHA, A. ŠIMEK, V. RŮŽIČKA, R. SZENDIUCH, I.

Original Title

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Type

article in a collection out of WoS and Scopus

Language

English

Original Abstract

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

Keywords

Through-hole, reverse pulse plating, copper plating, PCB

Authors

OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I.

Released

28. 4. 2016

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Location

Brno

ISBN

978-80-214-5350-0

Book

Proceedings of the 22nd Conference STUDENT EEICT 2016

Pages from

610

Pages to

614

Pages count

5

BibTex

@inproceedings{BUT124490,
  author="Alexandr {Otáhal} and Adam {Crha} and Václav {Šimek} and Richard {Růžička} and Ivan {Szendiuch}",
  title="ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="610--614",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}