Publication detail

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

STARÝ, J., KAZELLE, J.

Original Title

Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere

Type

conference paper

Language

English

Original Abstract

Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settings. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes. Two method were used:

Keywords

lead free, solderability, wettability, surface finish, flux, nitrogen, forming gas

Authors

STARÝ, J., KAZELLE, J.

RIV year

2004

Released

9. 9. 2004

Publisher

MPO

Location

Praha

ISBN

80-239-2835-X

Book

3rd European Microelectronics and Packaging Symposium

Pages from

589

Pages to

595

Pages count

7

BibTex

@inproceedings{BUT12623,
  author="Jiří {Starý} and Jiří {Kazelle}",
  title="Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere",
  booktitle="3rd European Microelectronics and Packaging Symposium",
  year="2004",
  pages="7",
  publisher="MPO",
  address="Praha",
  isbn="80-239-2835-X"
}